ATOM-130N NXP i.MX 8M Mini SoM System on Module

The ATOM-130N NXP i.MX 8M Plus SoM (System on Module) is a powerful and versatile solution, featuring up to four ARM Cortex-A53 1.8 GHz processors and one Cortex®-M7 CPU, 2.3 Tops NPU. It delivers exceptional performance, rich multimedia capabilities, and versatile connectivity options, all while maintaining a compact footprint and energy efficiency, suitable for a variety of applications, including Machine Learning, Vision, Multimedia, Industrial IoT and lightweight AI-powered solutions.

  • CPU: Quad Cortex®-A53 processors operation up to 1.6 GHz Cortex®-M7 CPU operating up to 800 MHz
  • GPU/NPU: 2.3 TOPS NPU; Includes VPU, GPU, ISP, HiFi 4, and CAN-FD
  • RAM/eMMC: RAM up to 2GB, eMMC up to 16GB
  • OS: Linux
  • Interfaces: USB 2.0, USB 3.0, PCIE, MIPI, HDMI, Ethernet, etc.
Dimensions: 62mm x 36mm, featuring a board-to-board connector
SKU: ATOM-130N Category: Tags: ,

Description

NXP i.MX8M Plus SoM Highlights

The ATOM-130N NXP iMX8M Plus System on Module / Computer on Module is based on a 1.8GHz Quad Cortex™-A53 NXP’s iMX8M Plus processor with 800MHz Cortex™-M7 Real-time co-processor – a new generation of processors that combine integrated Artificial Intelligence (AI) / Machine Learning (ML) capabilities with advanced multimedia features.

The SoM includes a dedicated Neural Processing Unit (NPU), an intelligent vision system based on an Image Signal Processor (ISP) and dual camera inputs, as well as advanced multimedia and connectivity features such as H.265 HD video encode and decode engines, advanced 2D/3D GPU, voice processing.

High-Performance Heterogeneous Multi-core Architecture

At the heart of the ATOM-130N NXP iMX8M Plus SoM lies a powerful combination of quad-core Cortex-A53 processors and a Cortex-M7 microcontroller. The Cortex-A53 cores operate at up to 1.8GHz, delivering robust processing power for complex computations and multitasking. Concurrently, the Cortex-M7 microcontroller, clocked at 800MHz, efficiently handles real-time control tasks, ensuring low-latency and high-reliability performance. This heterogeneous architecture allows for offloading critical tasks to specialized cores, thereby optimizing the overall system performance and power consumption.

2.3 Tops NPU AI Capabilities for Machine Learning

The integrated Neural Processing Unit (NPU) in the ATOM-130N NXP iMX8M Plus SoM provides up to 2.3 TOPS of dedicated AI computational power, which significantly accelerates machine learning inference, enabling advanced AI applications such as object recognition, facial detection, and natural language processing at the edge. iMX8M Plus SoM also Integrated machine learning accelerator that can process neural networks roughly thirty times faster than Arm® processor cores. NXP eIQ software includes inference engines, neural network compilers and optimized libraries.

Robust Multimedia Capabilities, 3D/2D Graphics Acceleration

Equipped with dual Image Signal Processors (ISP) and capable of handling multiple camera inputs, the ATOM-130N NXP iMX8M Plus SoM excels in advanced vision systems. The module supports high-definition video encoding and decoding, including formats like H.265 and H.264, and offers impressive 3D and 2D graphic acceleration. The HDMI port allows for 4K resolution output. Furthermore, it includes LVDS and MIPI-DSI interfaces. Meanwhile, It supports three display interfaces and advanced audio capabilities such as Cadence® Tensilica® HiFi 4 DSP @ 800 MHz, 6x I2S TDM, DSD512, S/PDIF Tx + Rx, 8-channel PDM microphone input, eARC, and ASRC.

This makes the ATOM-130N system on module is an ideal choice for applications requiring high-quality video streaming, video conferencing, and digital signage.

robust dsom 130n

Rich and High Speed Communication Interfaces

The ATOM-130N NXP iMX8M Plus SoM comes with a plethora of I/O interfaces including multiple USB ports (USB 3.1 Gen 1), Ethernet, PCIe, and various serial interfaces such as I2C, SPI, and UART. These interfaces ensure seamless connectivity and integration with a wide range of peripherals. Furthermore, the module offers flexible storage configurations, with options for up to 2GB of RAM and up to 16GB eMMC storage capacities, catering to diverse application requirements.

High Reliability & Low Power Design for Industrial Application

Designed for industrial applications, the ATOM-130N NXP iMX8M Plus SoM boasts a high reliability with an operating temperature range of -40°C to +85°C, making it suitable for harsh environments. The module is optimized for low power consumption, ensuring efficient operation that is crucial for battery-powered and energy-sensitive applications. Advanced power management features help in reducing the overall energy footprint, contributing to long-term sustainability and cost savings.

Custom Development and Embedded Board Services

Need More Than Just a System on Module? Talk to us about Single Board Computers, Complete Products and Customized Solutions Services.

NXP i.MX8M Plus SoC Block Diagram

Basic Parameters and Interfaces of ATOM-130N NXP i.MX8M Plus SoM

Item Parameter
CPU Quad Cortex®-A53 processors operation up to 1.6 GHz
Cortex®-M7 CPU operating up to 800 MHz
GPU ● GC7000UL with OpenCL and Vulkan support
● 2 shaders
● 166 million triangles/sec
● 1.0 giga pixel/sec
● 16 GFLOPs 32-bit
● Supports OpenGL ES 1.1, 2.0, 3.0, OpenCL 1.2, Vulkan
● Core clock frequency of 1000 MHz
● Shader clock frequency of 1000 MHz
● GC520L for 2D acceleration
● Render target compatibility between 3D and 2D GPU (super tile status buffer)
VPU Video Decode
● 1080p60 HEVC/H.265 Main, Main 10 (up to level 5.1)
● 1080p60 VP9 Profile 0, 2
● 1080p60 VP8
● 1080p60 AVC/H.264 Baseline, Main, High decoder
Video Encode
● 1080p60 AVC/H.264 encoder
● 1080p60 HEVC/H.265 encoder
RAM 2GB (1GB/4GB optional)
NPU 2.3 TOP/s Neural Network performance
● Keyword detect, noise reduction, beamforming
● Speech recognition (i.e. Deep Speech 2)
● Image recognition (i.e. ResNet-50)
Storage eMMC 16 GB (8GB / 16GB / 32GB eMMC optional)
Operating Voltage Typical voltage 5V/2.5A
OS Linux
Temperature Operating Temperature: -40 °C ~80 °C
Storage Temperature: -40 °C ~85 °C
Humidity 10~95% (Non-condensing)
Barometric Pressure 76Kpa ~106Kpa
Size 62mm × 36mm × 4.0mm
USB 2.0 2 X USB2.0, two of which is for OTG
USB 3.0 2 X USB3.0,with intergrated PHY
PCIE 2 X PCIE, Supports 1-way PCI Express Gen3.0
MIPI CSI 2 X MIPI CSI,Provide two 4-lane MIPI camera serial interfaces, capable of
operating up to 1.5 Gbps
MIPI DSI 1 X MIPI DSI,Provide 1 4-lane MIPI display serial interface, capable of
operating up to 1.5 Gbps
● 1080 p60
● WUXGA (1920×1200) at 60 Hz
● 1920×1440 at 60 Hz
● UWHD (2560×1080) at 60 Hz
● WQHD (2560×1440) by reduced blanking mode
HDMI 1X HDMI
● Supports HDMI 2.0a display resolution up to 4Kp30
● Supports HDMI2.1 eARC
LVDS 1X LVDS,
● Single channel (4 lanes) support 720p60;
● Dual asynchronous channels (8 data, 2clocks) support 1920x1200p60
Ethernet 2 X RGMII, Supports two RGMII interfaces, with one supporting TSN
SDIO 2 X SDIO
● SD2, 4-bit, supports 1.8/3.3V mode switching;
● SD1, 8-bit, only supports 1.8V mode
4 X UART , The maximum supported baud rate is 4Mbp
SPI 3 X SPI , The maximum supported speed is 52Mbit/s, and the master-slave mode can be configured
I2C 5 X I2C, The maximum speed supported in standard mode is 100Kbit/s;
The maximum supported speed in fast mode is 400Kbit/s
CAN 2 X CAN, The communication controller of CAN is implemented using the CAN FD protocol, as well as the CAN protocol that complies with the CAN 2.0B protocol specification. (CAN FD requires CPU version support)
SAI 6 X SAI, Synchronous Audio Interface (SAI), a full duplex serial interface that supports frame synchronization, such as I2S, AC97, TDM, and codec/DSP interfaces
SPDIF 1 X SPDIF,A standard audio file transfer format jointly developed by Sony and Philips
PWM 4 X PWM,With 16 bit counter
QSPI 1 X QSPI,Already occupied by the core board, connected to 16MB of No Flash
JTAG 1 X JTAG,For debugging
Upgrade supports local firmware upgrades via USB interface

Wide Range of Application Scenarios

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